On July 14th, 2025, University of Science and Technology - The University of Danang (UD-DUT) hosted a working session and signed a Memorandum of Understanding (MOU) with University at Buffalo (UB), a prestigious public university in New York State, US.

Assoc. Prof. Le Tien Dung, Vice-Rector of UD-DUT, emphasised that the MOU not only strengthens academic and research ties but also leverages both parties’ core strengths in key disciplines such as Embedded Systems, the Internet of Things (IoT),  Electronics and Telecomunications Engineering.

According to Professor Kemper Lewis, Rector of the School of Engineering and Applied Sciences, shared that UB has a long-standing tradition dating back to its founding in 1846. 

UB is recognized as one of the leading and most reputable public universities, renowned for its advanced science and engineering disciplines.

Today, its student body numbers around 30,000, including a diverse community of 5,000 international students from almost 100 nations and territories.

Expressing excitement about the collaboration with UD-DUT, the UB representative highlighted the strong alignment in their engineering and technology programs. 

They expressed hope that this partnership will serve as a landmark for fostering long-term collaboration, promoting knowledge sharing, and driving innovation, ultimately expanding their collective influence both regionally and internationally.

According to the signed MOU, the two parties will promote cooperation in developing international joint training programs through transfer pathways in Embedded Systems, IoT, and Electronics and Telecommunications Engineering at both undergraduate and postgraduate levels. 

The collaboration also includes faculty and student exchanges, joint research and teaching initiatives, as well as the development and implementation of bilateral projects and programs.

UD Media

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