On August 26, University of Science and Technology – the University of Danang (DUT-UD) chaired and coordinated with partners to organize the 4th International Conference on Transportation Infrastructure and Sustainable Development (TISDIC 2023).

There was the attendance of Mr. Le Quang Nam – Vice Chairman of Danang City People’s Committee, Dr. Dang Viet Dung – Chairman of the Vietnam Construction Association, Assoc. Prof. Dr. Nguyen Hong Hai – Vice Rector of DUT-UD, Prof. Rafat Siddique – Thapar Institute of Engineering and Technology (India), Assoc. Prof. Dr. Phan Cao Tho – Rector of University of Technology and Education – UD and nearly 300 delegates who are managers, scientists, experts and businessmen in the fields of construction and transportation.

The highlight of this conference is the participation of more than 130 scientists and speakers from 17 countries, including 8 keynote speakers who are prestigious scientists in the world. The conference also received sponsorship and companionship from many partners and businesses.

The delegates at the conference.

Speaking at the conference, Assoc. Prof. Dr. Nguyen Hong Hai warmly welcomed the delegates, scientists, managers, experts, lecturers, businesses. The TISDIC is increasingly becoming a “bridge” of network connecting scientific and technology community to solve challenges related to transportation infrastructure and sustainable development.

Dr. Dang Viet Dung said that in the context of our country is promoting industrialization and modernization, attracting investment and promoting economic growth and international integration, construction and transportation infrastructure issues have national and global opportunities and challenges.

At the conference, delegates listened to and discussed reports and presentations at 4 plenary sessions and 20 presentation sessions at sub-committees. Delegates focused on specialized topics in the fields of infrastructure and transportation construction: civil construction and urban development, geotechnical and environmental engineering, AI, IoT and automatic applications.